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Semiconductor

Research

  • Physics Based Simulation and Calibration of GaN/AlGaN/GaN HEMT Device

  • Investigations of Low Dynamic Ron on GaN/AlGaN/GaN HEMT by Field Plate Using Physical Device Simulations.

  • FULLY ION-IMPLANTED 1200V LDMOS WITH LINEAR P-TOP TECHNOLOGY

  • An Innovative TCAD Simulated UHV-PLDMOS   Device with Improved HTRB Performance

  • COMPARISON OF SIMULATION TOOLS FOR BCD INTEGRATION

  • Ultrasound imaging in medicine and biology.

  • Designed and development novel “Cochlea Implant” apply in next generation.

  • Designed novel Opto-electromagnetic actuator for new generation of audiphones.

  • Medicine Delivery Process Technologies.

  • Designed active canceling, passive shielding and hybrid canceling technology to reduce Electromagnetic Interference (EMI).

  • Ultraviolet ray/oxidation process as chemical oxidant to remove and clean Airborne Molecular Contamination (AMC).

  • Surface Acoustic Wave (SAW) device apply to gas sensor device.

  • Ultrasonic Spray Pyrolysis for Nanoparticles Synthesis.

  • Silicon-Based High Frequency Ultrasonic Nozzles and Applications to Micro-and Nano-Electronics.

  • MEMS-Based Microfabrication Technologies.

  • Fabrication and Characterization of Metallic Compounds.

  • Nano-wire and Nano-particle Process Technologies.

  • Surface Acoustic Wave (SAW) device and Application to Micro-and Nano- Mono-disperse drops.

Instrument Skills

  • X-ray diffraction (XRD) and Transmission electron microscopy (TEM).

  • Atomic and magnetic force microscopes (AFM & MFM)

  • Field Emission-Scanning electron microscope (FE-SEM)

  • Superconducting quantum interference device (SQUID)

  • Magneto-optical Kerr effect (MOKE)

  • Double Side Mask Aligner and Spin Coater.

  • Alpha-Step Surface Profiler and Ellipsometer.

  • Precision Dicing Saw and Wire Bonder.

  • Electron Beam Evaporator and Thermal Evaporator.

  • Inductive Coupling Plasma Etching (ICP) and Reactive Ion Etching System (RIE).

  • RF and DC Sputter.

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